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Title:
POLISHING PAD, PRODUCTION METHOD FOR SAME, AND PRODUCTION METHOD FOR GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/142177
Kind Code:
A1
Abstract:
Disclosed is a polishing pad that can flatten a polishing object that has received finish polishing, including an edge section thereof, by making the edge section of the polishing object that has received rough polishing into a blade shape. Also disclosed is a production method for glass substrate semiconductors that uses said polishing pad. The polishing pad, which has a polishing layer made from a thermosetting polyurethane foam, is adjusted such that the thermosetting polyurethane foam has an Asker C hardness value after soaking in water for 24 hours of 82 max., at a 60-second value, and a tensile storage modulus (E'(30˚C)) value at a frequency of 1.6 Hz that fulfills the following formula (1): Y<5X-150 (wherein Y represents the tensile storage modulus (E' (MPa)) and X represents the Asker C hardness value after 24 hours soaking in water (60-second value)).

Inventors:
SATO,Akinori (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
佐藤 彰則 (〒61 大阪府大阪市西区江戸堀1丁目17番18号 東洋ゴム工業株式会社内 Osaka, 〒5508661, JP)
Application Number:
JP2011/056704
Publication Date:
November 17, 2011
Filing Date:
March 22, 2011
Export Citation:
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Assignee:
TOYO TIRE & RUBBER CO.,LTD. (17-18, Edobori 1-chomeNishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀1丁目17番18号 Osaka, 〒5508661, JP)
SATO,Akinori (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
International Classes:
B24B37/00
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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Claims:



 
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