Title:
POLISHING PAD, POLISHING PAD PRODUCTION METHOD, AND METHOD FOR POLISHING SURFACE OF OPTICAL MATERIAL OR SEMICONDUCTOR MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/188476
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polishing pad that minimizes defects in a polished object, is capable of achieving a flat topography, and exhibits excellent defect performance and topography performance. Provided is a polishing pad having a polishing layer that contains a polyurethane resin, wherein: the polyurethane resin is a cured product of a curable resin composition comprising an isocyanate-terminated urethane prepolymer and a curing agent; the isocyanate-terminated urethane prepolymer is a reaction product between a polyisocyanate component and a polyol component containing a glycol having a molecular weight of 50-300; and the content of the glycol is more than 0 wt% but less than 5 wt% with respect to the total amount of the isocyanate-terminated urethane prepolymer.
Inventors:
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2019/011087
Publication Date:
October 03, 2019
Filing Date:
March 18, 2019
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/24; C08G18/10; C08G18/32; C08G18/38; C08G18/48; C08G18/66; C08G18/76; C08J5/14; H01L21/304
Domestic Patent References:
| WO2016021317A1 | 2016-02-11 | |||
| WO2017217278A1 | 2017-12-21 |
Foreign References:
| JPH11322878A | 1999-11-26 | |||
| JP2008252017A | 2008-10-16 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
Download PDF:
Previous Patent: TRIAZINE-RING-CONTAINING POLYMER, RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING ELEMENT
Next Patent: FILM-FORMING DEVICE
Next Patent: FILM-FORMING DEVICE