Title:
POLISHING PAD AND PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/122386
Kind Code:
A1
Abstract:
Provided is a polishing pad with which microscopic undulations that occur on the surface of an object to be polished can be reduced. Also provided is a method for producing the polishing pad, and a method for producing a semiconductor device. A polishing pad having a polishing layer comprising a thermosetting polyurethane foam that contains as ingredients: an active hydrogen-containing compound that contains 10 to 50 parts by weight of a trifunctional polyol, in which at least one of the terminal hydroxyl groups is a secondary hydroxyl group and the hydroxyl value is 150 to 1000 mg KOH/g, in 100 parts by weight of the active hydrogen-containing compound; and an isocyanate component. By using the thermosetting polyurethane foam, in-plane variations in microrubber A hardness of the polishing layer measured from the polishing surface side are restricted to 12 or less.
Inventors:
ITO,Aya (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
伊藤 彩 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 〒5508661, JP)
伊藤 彩 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 〒5508661, JP)
Application Number:
JP2011/056703
Publication Date:
October 06, 2011
Filing Date:
March 22, 2011
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO.,LTD. (17-18, Edobori 1-chomeNishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 Osaka, 〒5508661, JP)
ITO,Aya (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 Osaka, 〒5508661, JP)
ITO,Aya (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
International Classes:
B24B37/00; H01L21/304
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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Claims: