Title:
POLISHING PAD, PRODUCTION METHOD THEREFOR, PRODUCTION METHOD FOR POLISHED ARTICLE, LAPPING PAD, PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR LAPPED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/138958
Kind Code:
A1
Abstract:
The present invention provides, for example, a polishing pad which is capable of providing favorable flatness to a polishing target article, and which has excellent affinity to a slurry. Provided is, for example, a polishing pad comprising a resin sheet that has pores, wherein in the pore distribution of the resin sheet, as measured by mercury intrusion with a contact angle of 130° and a mercury surface tension of 485 dyn/cm, the cumulative pore volume V in the pore diameter range of 0.010-1.0 μm is 0.21-1.00 cm3/g, and the density of the resin sheet is 0.3-0.9 g/cm3.
Inventors:
KAWANO TETSUYA (JP)
Application Number:
PCT/JP2021/048381
Publication Date:
June 30, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/24; C08J5/14; C08J9/02; C08J9/04; H01L21/304
Foreign References:
| JP2005512832A | 2005-05-12 | |||
| JP2009514690A | 2009-04-09 | |||
| JP2005539398A | 2005-12-22 | |||
| JP2001348271A | 2001-12-18 | |||
| JP2005236200A | 2005-09-02 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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