Title:
POLISHING PAD, POLISHING TOOL, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/169041
Kind Code:
A1
Abstract:
Provided is a polishing pad that polishes a curved surface to be polished of an object to be polished, by a polishing surface which follows curved surfaces having various curvatures, whereby the waviness of the curved surface to be polished can be removed. A polishing pad (10) is provided with: a first layer (1) having a polishing surface (10a); and a second layer (2) supporting the first layer (1) and being formed of an elastic body. The first layer (1) has three or more cutouts (1a) radially formed so as to each extend from the outer edge thereof toward the center. The outer circumferential edge side portion of the first layer (1) is divided into a plurality of petal-shaped regions (1A, 1B, 1C, ...) by the cutouts (1a).
Inventors:
HOTTA KAZUTOSHI (JP)
KAMADA TORU (JP)
HASE EIJI (JP)
KAMADA TORU (JP)
HASE EIJI (JP)
Application Number:
PCT/JP2018/010423
Publication Date:
September 20, 2018
Filing Date:
March 16, 2018
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
B24B29/00; B24B37/11; B24D13/14
Domestic Patent References:
| WO2016031142A1 | 2016-03-03 |
Foreign References:
| JPS604360U | 1985-01-12 | |||
| JP2000233358A | 2000-08-29 | |||
| JPH11156701A | 1999-06-15 | |||
| US20040248501A1 | 2004-12-09 | |||
| JPH069869U | 1994-02-08 |
Attorney, Agent or Firm:
SUZUKI Sohbe et al. (JP)
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