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Patent Searching and Data


Title:
POLISHING PAD FOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/151584
Kind Code:
A1
Abstract:
The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.

Inventors:
AHN, Jin Woo (132-11, 3gongdan 3-roGumi-si, Gyeongsangbuk-do, 39400, KR)
Application Number:
KR2018/006352
Publication Date:
August 08, 2019
Filing Date:
June 04, 2018
Export Citation:
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Assignee:
SK SILTRON CO., LTD. (53 Imsu-ro, Gumi-si, Gyeongsangbuk-do, 39386, KR)
International Classes:
B24B37/26; B24B37/22; B24D11/00; B24D18/00
Attorney, Agent or Firm:
LEE, Seung Chan (KPH & Associates, 3rd Floor Nara Bldg., 19, Seochojungang-ro 24-gil,,Seocho-gu, Seoul, 06604, KR)
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