Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2000/012262
Kind Code:
A1
Abstract:
A polishing pad, characterized by having a micro-rubber. A hardness number of 80 or larger, closed cells with an average cell diameter of not larger than 1000 $g(m)m and a density ranging from 0.4 to 1.1 and containing a polymer polymerized from polyurethane and a vinyl compound, the polishing pad having a high finishing rate, being small in global step difference and not likely to cause metal wire dishing, loading and permanent set in fatigue at a front layer portion and providing a stable finishing rate when a localized unevenness on a semiconductor substrate is to be flattened.
Inventors:
SHIRO KUNIYASU (JP)
HASHISAKA KAZUHIKO (JP)
OKA TETSUO (JP)
HASHISAKA KAZUHIKO (JP)
OKA TETSUO (JP)
Application Number:
PCT/JP1999/004584
Publication Date:
March 09, 2000
Filing Date:
August 25, 1999
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
SHIRO KUNIYASU (JP)
HASHISAKA KAZUHIKO (JP)
OKA TETSUO (JP)
SHIRO KUNIYASU (JP)
HASHISAKA KAZUHIKO (JP)
OKA TETSUO (JP)
International Classes:
B24B37/20; B24B37/24; B24D3/28; B24D13/14; (IPC1-7): B24B37/00
Foreign References:
| JPH0288229A | 1990-03-28 | |||
| JPS6176275A | 1986-04-18 | |||
| JPH07297195A | 1995-11-10 | |||
| JPH07164307A | 1995-06-27 | |||
| JPH06220151A | 1994-08-09 | |||
| JPH05505769A | 1993-08-26 |
Other References:
See also references of EP 1108500A4
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