POLISHING PAD

WIPO Patent Application WO/2008/029538

A1

Disclosed is a polishing pad having excellent durability. The polishing pad has a substrate layer and a polishing layer provided on the substrate layer, wherein the polishing layer comprises a thermocurable polyurethane foam having therein approximately spherical interconnected cells with an average cell diameter of 35 to 300 μm.

FUKUDA, Takeshi (LTD.17-18 Edobori 1-chome, Nishi-k, Osaka-shi Osaka 61, 5508661, JP)
福田 武司 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 5508661, JP)
MARUYAMA, Satoshi (LTD.17-18 Edobori 1-chome, Nishi-k, Osaka-shi Osaka 61, 5508661, JP)
丸山 覚史 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 5508661, JP)
HIROSE, Junji (LTD.17-18 Edobori 1-chome, Nishi-k, Osaka-shi Osaka 61, 5508661, JP)

JP2007/058758

March 13, 2008

April 23, 2007

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TOYO TIRE & RUBBER CO., LTD. (17-18, Edobori 1-chome Nishi-ku, Osaka-sh, Osaka 61, 5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 Osaka, 5508661, JP)
FUKUDA, Takeshi (LTD.17-18 Edobori 1-chome, Nishi-k, Osaka-shi Osaka 61, 5508661, JP)
福田 武司 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 5508661, JP)
MARUYAMA, Satoshi (LTD.17-18 Edobori 1-chome, Nishi-k, Osaka-shi Osaka 61, 5508661, JP)
丸山 覚史 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 5508661, JP)

B24B37/00; H01L21/304

OZAKI, Yuzo et al. (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 5320011, JP)

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