Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2008/029725
Kind Code:
A1
Abstract:
Provided is a polishing pad for improving qualities of a polishing object by improving planarity
of the object. Machining process such as buff process is performed to a polishing
surface (1a) of a polishing pad (1) to have improved planarity, swells on the polishing
surface in a cycle of 5mm-200mm, with a maximum amplitude of 40μm or less.
Thus, planarity of the object, such as a silicon wafer, to be polished by using
the polishing pad (1) is improved.
Inventors:
PARK, Jaehong (())
朴 栽弘 (())
MATSUMURA, Shinichi (())
松村 進一 (())
YOSHIDA, Kouichi (())
朴 栽弘 (())
MATSUMURA, Shinichi (())
松村 進一 (())
YOSHIDA, Kouichi (())
Application Number:
JP2007/066980
Publication Date:
March 13, 2008
Filing Date:
August 31, 2007
Export Citation:
Assignee:
NITTA HAAS INCORPORATED (4-26, Sakuragawa 4-chome Naniwa-ku, Osaka-sh, Osaka 22, 5560022, JP)
ニッタ・ハース株式会社 (〒22 大阪府大阪市浪速区桜川４丁目４番２６号 Osaka, 5560022, JP)
PARK, Jaehong (())
朴 栽弘 (())
MATSUMURA, Shinichi (())
松村 進一 (())
ニッタ・ハース株式会社 (〒22 大阪府大阪市浪速区桜川４丁目４番２６号 Osaka, 5560022, JP)
PARK, Jaehong (())
朴 栽弘 (())
MATSUMURA, Shinichi (())
松村 進一 (())
International Classes:
B24B37/00; H01L21/304
Attorney, Agent or Firm:
OKADA, Kazuhide (Chiyoda Bldg. Kitakan, 13-38 Naniwa-cho, Kita-kuOsaka-sh, Osaka 22, 5300022, JP)
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