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Patent Searching and Data


Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2011/129254
Kind Code:
A1
Abstract:
Disclosed is a polishing pad (1), which can detect an optical end point with high accuracy when polishing is being performed, and which can prevent a slurry from leaking from the polishing layer (10) side to the cushion layer (12) side, even in the case wherein the polishing pad has been used for a long period of time. Also disclosed is a method for manufacturing a semiconductor device using the polishing pad. In the polishing pad, the polishing layer, which has a polishing region (8) and a light transmitting region (9), and the cushion layer, which has a through hole (11), are laminated with a double-sided adhesive sheet (15) therebetween such that the light transmitting region and the through hole overlap each other. A translucent member (16) is bonded to the adhesive layer (14) of the double-sided adhesive sheet in the through hole.

Inventors:
KIMURA,Tsuyoshi (LTD.17-18Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
Application Number:
JP2011/058778
Publication Date:
October 20, 2011
Filing Date:
April 07, 2011
Export Citation:
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Assignee:
TOYO TIRE & RUBBER CO.,LTD. (17-18, Edobori 1-chomeNishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀1丁目17番18号 Osaka, 〒5508661, JP)
International Classes:
H01L21/304; B24B37/22
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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Claims: