Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2014/119367
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a polishing pad which is not susceptible to deterioration due to moisture absorption in a moisture-absorbing environment, while having excellent polishing characteristics, service life characteristics and high polishing rate; and a method for producing the polishing pad. A polishing pad of the present invention has a polishing layer that is formed of a polyurethane foam having fine cells. The polyurethane foam is a reaction cured body of a chain extender and an isocyanate-terminated prepolymer which is obtained by reacting a prepolymer starting material composition that contains an isocyanate component, a high molecular weight polyol and an aliphatic diol. The high molecular weight polyol contains a polyalkylene glycol A that has a peak of the molecular weight distribution within the range of 200-300 and a polyalkylene glycol B that has a peak of the molecular weight distribution within the range of 800-1,200.
Inventors:
SEYANAGI HIROSHI (JP)
Application Number:
PCT/JP2014/050577
Publication Date:
August 07, 2014
Filing Date:
January 15, 2014
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO (JP)
International Classes:
B24B37/24; H01L21/304
Foreign References:
| JP2005512832A | 2005-05-12 | |||
| JP2008221367A | 2008-09-25 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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