Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2016/039334
Kind Code:
A1
Abstract:
Provided is a polishing pad which is capable of achieving sufficient polishing accuracy if used for mirror finish polishing.
This polishing pad 1 is obtained by bonding a polishing film 9 to the outer circumferential surface of a circular disk-shaped center base 7, and is characterized in that the polishing film 9 is formed by a wet film forming method. This polishing pad 1 having the above-described configuration enables the achievement of a polishing pad wherein a polishing film 9 formed by a wet film forming method is bonded on the outer circumference. By performing finish polishing with use of the polishing film 9 formed by a wet film forming method, a product which is reduced in distortion of reflected light and scratches, while having a stable shape can be obtained.
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Inventors:
KOIKE KENICHI (JP)
TOKUSHIGE SHIN (JP)
KASHIWADA HIROSHI (JP)
KURIHARA HIROSHI (JP)
TOKUSHIGE SHIN (JP)
KASHIWADA HIROSHI (JP)
KURIHARA HIROSHI (JP)
Application Number:
PCT/JP2015/075454
Publication Date:
March 17, 2016
Filing Date:
September 08, 2015
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B29/00; B24B37/11; B24B37/24
Domestic Patent References:
| WO2001062436A1 | 2001-08-30 |
Foreign References:
| JP2006156688A | 2006-06-15 | |||
| JP2014069273A | 2014-04-21 | |||
| JP2012020349A | 2012-02-02 |
Attorney, Agent or Firm:
NISHIJIMA Takaki et al. (JP)
Takayoshi Nishijima (JP)
Takayoshi Nishijima (JP)
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