Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2018/181347
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a polishing pad having excellent polishing performance and excellent polishing slurry discharging characteristics.
This polishing pad has a polishing portion and a groove portion in a polishing surface, wherein the surface of the groove portion comprises an unfoamed portion, and a foamed portion is revealed at the surface of the polishing portion.
Inventors:
YOKOTA NOBUTOSHI (JP)
SUGIYAMA SHOTA (JP)
NARIMATSU TAKASHI (JP)
SUGIYAMA SHOTA (JP)
NARIMATSU TAKASHI (JP)
Application Number:
PCT/JP2018/012483
Publication Date:
October 04, 2018
Filing Date:
March 27, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B24B37/26; B24B37/24; C08L67/02; C08L69/00; C08L81/02; H01L21/304
Domestic Patent References:
| WO2016122888A1 | 2016-08-04 |
Foreign References:
| JP2015503232A | 2015-01-29 | |||
| JP2006186239A | 2006-07-13 | |||
| JP2006159380A | 2006-06-22 | |||
| JP2013208696A | 2013-10-10 | |||
| JP2013202775A | 2013-10-07 | |||
| JP2014195839A | 2014-10-16 | |||
| JP2006341368A | 2006-12-21 | |||
| JP2013176824A | 2013-09-09 | |||
| JP2001277304A | 2001-10-09 | |||
| JP2000349053A | 2000-12-15 | |||
| JP2014008555A | 2014-01-20 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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