Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2023/013576
Kind Code:
A1
Abstract:
This polishing pad has a polishing layer having a circular polishing surface, and is also provided with a spiral groove or concentric circular grooves consisting of a plurality of annular grooves arranged in concentric circles and formed spanning from a central region of the polishing surface to a circumferential edge region, and radiating grooves consisting of line segment grooves extending from the central region toward the circumferential edge region. The line segment grooves have first end sections in a region at a distance 5-10% of the radius of the polishing surface from the center of the radiating grooves and have second end sections in a region at a distance 35-70% of the radius of the polishing surface from the center of the radiating grooves. The line segment grooves have an average length that is a 30-65% proportion of the radius of the polishing surface. A cross-sectional area Sa (mm2) of the line segment grooves and a cross-sectional area Sb (mm2) of the spiral groove or concentric circular grooves satisfy the formula 0.1 ≤ Sb/Sa < 1.0.
Inventors:
SUNAYAMA AZUSA (JP)
KATO MITSURU (JP)
TAKEGOSHI MINORI (JP)
KATO MITSURU (JP)
TAKEGOSHI MINORI (JP)
Application Number:
PCT/JP2022/029479
Publication Date:
February 09, 2023
Filing Date:
August 01, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B24B37/26; B24B37/24; H01L21/304
Foreign References:
| JP2000237950A | 2000-09-05 | |||
| JP2020009987A | 2020-01-16 | |||
| JP2005183708A | 2005-07-07 | |||
| JP2000237950A | 2000-09-05 | |||
| JP2011177884A | 2011-09-15 | |||
| JP2017208530A | 2017-11-24 | |||
| TWM459065U | 2013-08-11 |
Attorney, Agent or Firm:
EGAWA Masaru (JP)
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