Title:
POLISHING SHEET AND METHOD
Document Type and Number:
WIPO Patent Application WO/2002/022308
Kind Code:
A1
Abstract:
A polishing pad and method, wherein surface dressing is made unnecessary, no deformation occurs with the lapse of working time, there is no clogging otherwise caused by abrasive grains or abraded chips, and the surface of a polish-object article can be made flat to a high degree. A polishing pad (10) formed by applying a cloth sheet to a base sheet. A polishing method comprising the steps of feeding a polishing liquid to the surface of the polishing pad (10) applied to a rotating surface plate (D) through a nozzle (N), and pressing a polish-object article (11) stuck to a rotating head (H) against the surface of the polishing pad (10).
Inventors:
MARUKAWA TAKABUMI (JP)
IZUMI TOSHIHIRO (JP)
KOBAYASHI TOSHIHIRO (JP)
IZUMI TOSHIHIRO (JP)
KOBAYASHI TOSHIHIRO (JP)
Application Number:
PCT/JP2000/007442
Publication Date:
March 21, 2002
Filing Date:
October 24, 2000
Export Citation:
Assignee:
NIPPON MICRO COATING KK (JP)
MARUKAWA TAKABUMI (JP)
IZUMI TOSHIHIRO (JP)
KOBAYASHI TOSHIHIRO (JP)
MARUKAWA TAKABUMI (JP)
IZUMI TOSHIHIRO (JP)
KOBAYASHI TOSHIHIRO (JP)
International Classes:
B24B7/07; B24B37/20; B24B37/24; B24D11/00; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Foreign References:
| JPS5590263A | 1980-07-08 | |||
| US5885334A | 1999-03-23 |
Attorney, Agent or Firm:
Takeuchi, Sumio (Nishishinbashi 1-chome Minato-Ku, Tokyo, JP)
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