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Patent Searching and Data


Title:
POLISHING SHEET AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/135180
Kind Code:
A3
Abstract:
Object: To provide a polishing sheet capable of efficiently polishing a hard material such as a metal product so as to form a smooth surface with minimal unevenness. Solution: A polishing sheet (10) including: a substrate (11); a plurality of three-dimensional elements (12) containing abrasive grains and a binding material; and an intermediate layer (13) provided between the three-dimensional elements (12) and the substrate (11) so as to join the substrate (11) and the three-dimensional elements (12), wherein a Young's modulus of the substrate (11) at 25°C is not less than 3.0 x 109Pa; and a Young's modulus of the intermediate layer (13) at 25°C is not less than 1.0 x 107Pa and not greater than 5.0 x 108Pa.

Inventors:
NAKAMURA, Yoko (6-7-29 Kitashinagawa, Shinagawa-ku, Tokyo, 〒141-8684, JP)
TASAKA, Yoshihiko (6-7-29 Kitashinagawa, Shinagawa-ku, Tokyo, 〒141-8684, JP)
NAGAFUCHI, Naohiro (6-7-29 Kitashinagawa, Shinagawa-ku, Tokyo, 〒141-8684, JP)
Application Number:
IB2019/050029
Publication Date:
August 22, 2019
Filing Date:
January 02, 2019
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY (3M Center, Post Office Box 33427Saint Paul, Minnesota, 55133-3427, US)
International Classes:
B24D11/02; B24D3/00
Domestic Patent References:
WO2001004227A22001-01-18
WO1999059778A11999-11-25
Foreign References:
US20050152652A12005-07-14
US20080102720A12008-05-01
JP2017170534A2017-09-28
Attorney, Agent or Firm:
MEDVED, Aleksander et al. (3M Center, Office of Intellectual Property CounselPost Office Box 3342, Saint Paul Minnesota, 55133-3427, US)
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