Title:
POLISHING OF SILICON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/074835
Kind Code:
A1
Abstract:
One aspect provides a method for adjusting the polishing speed of a silicon substrate and the surface quality of the polished silicon substrate. In one aspect, this method is for adjusting the polishing speed of a silicon substrate and the surface quality of the polished substrate by: using a polishing liquid composition, which contains at least one component selected from the group consisting of an amino group-containing water‐soluble polymer compound (component A) having a pKa of 5-8.5 and a nonionic water‐soluble polymer compound (component B); and changing the content ratio of the component A and the component B.
Inventors:
MIURA JOJI
Application Number:
PCT/JP2020/038345
Publication Date:
April 14, 2022
Filing Date:
October 09, 2020
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2009131133A1 | 2009-10-29 | |||
| WO2016143323A1 | 2016-09-15 |
Foreign References:
| JP2006352042A | 2006-12-28 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
Download PDF: