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Title:
POLISHING SLURRY COMPOSITION FOR STI PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/124740
Kind Code:
A1
Abstract:
The present invention relates to a polishing slurry composition for an STI process and, more particularly, to a polishing slurry composition for an STI process, the composition comprising: a polishing solution including polishing particles; and an additive solution containing a polysilicon film polishing barrier inclusive of a polymer having an amide bond.

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Inventors:
KIM JUNG YOON (KR)
HWANG JUN HA (KR)
PARK KWANG SOO (KR)
YANG HAE WON (KR)
Application Number:
PCT/KR2018/013762
Publication Date:
June 27, 2019
Filing Date:
November 13, 2018
Export Citation:
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Assignee:
KCTECH CO LTD (KR)
International Classes:
C09G1/02; C09D183/04; C09G1/04; C09K3/14; H01L21/306
Foreign References:
KR20140133604A2014-11-19
US6824579B22004-11-30
KR20090084723A2009-08-05
CN101451047A2009-06-10
KR20140059346A2014-05-16
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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