Title:
POLISHING SLURRY CONTAINING BLENDED ABRASIVES FOR LOW DIELECTRIC MATERIAL
Document Type and Number:
WIPO Patent Application WO/2008/025208
Kind Code:
A1
Abstract:
A polishing slurry containing blended abrasives for low dielectric material
is disclosed, which includes two or more kinds of polishing abrasives, wherein,
one of the abrasives is Al-doped silica, and the second abrasive is the one selected
from silica, alumina, alumina -coated silica or zirconia-coated silica or their
combinations. The present polishing slurry not only can effectively adjust
the polishing speed of low dielectric carbon-doped silica (CDO) and silica,
but also can prevent local and throughout corrosion during metal polishing,
thus can improve the acceptability. Moreover, it is useful in integrate circuit
which contains metal,metal barrier, carbon-doped silica and silica simultaneously.
Inventors:
CHEN, Jery, Guodong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
SONG, Peter, Weihong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
宋伟红 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
JING, Judy, Jianfen (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
SONG, Peter, Weihong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
宋伟红 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
JING, Judy, Jianfen (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
Application Number:
CN2007/002101
Publication Date:
March 06, 2008
Filing Date:
July 09, 2007
Export Citation:
Assignee:
ANJI MICROELECTRONICS (SHANGHAI) CO., LTD. (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
安集微电子（上海）有限公司 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
CHEN, Jery, Guodong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
SONG, Peter, Weihong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
宋伟红 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
安集微电子（上海）有限公司 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
CHEN, Jery, Guodong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
SONG, Peter, Weihong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-Tech Park,Pudong, Shanghai 3, 201203, CN)
宋伟红 (中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
International Classes:
C09G1/02; C09K3/14; H01L21/304; C09G1/00; C09K3/14; H01L21/02
Attorney, Agent or Firm:
ZHENGHAN LAW FIRM (18th Floor, South Tower of Shanghai Stock Exchange BuildingN° 528 Pu Dong Road, Shanghai 0, 200120, CN)
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