Title:
POLISHING SLURRY FOR REMOVAL OF COBALT
Document Type and Number:
WIPO Patent Application WO/2014/132641
Kind Code:
A1
Abstract:
The present invention provides a mechanical chemical polishing composition for cobalt, said composition combining low static etching properties for cobalt and a high polish rate therefor and exhibiting a high selectivity for cobalt, namely, a high polish rate ratio of cobalt to copper. A polishing composition which contains abrasive grains and at least one Co-complexing agent, characterized in that: the composition has a pH of 9 or higher; and the Co-complexing agent has one or more functional groups selected from between phosphonic acid group (-P(=O)(OH)2) and carboxyl group (-C(=O)OH).
Inventors:
MILLER ANNE (US)
GRANSTROM JIMMY (US)
GRANSTROM JIMMY (US)
Application Number:
PCT/JP2014/001026
Publication Date:
September 04, 2014
Filing Date:
February 26, 2014
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00
Domestic Patent References:
| WO2013112490A1 | 2013-08-01 |
Foreign References:
| JP2011003665A | 2011-01-06 | |||
| JP2009087968A | 2009-04-23 | |||
| JP2008243857A | 2008-10-09 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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