Title:
POLISHING SLURRY FOR SUBTLE SURFACE PLANARIZATION AND ITS USING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/137508
Kind Code:
A1
Abstract:
A polishing slurry for subtle surface planarization and its using method are disclosed. The present polishing slurry for subtle surface planarization includes abrasive and water, it is characterized in that the abrasive is a colloidal Al-doped silica abrasive, this colloidal Al-doped silica abrasive is an aqueous dispersion of Al-doped silica. When using the present polishing slurry for subtle surface planarization in CMP process, the downward pressure is 0.5-3psi. The present polishing slurry for subtle surface –planarization can effectively polish Ta, TaN, TEOS, FSG, BD or other lower dielectric material and so on, and the polishing rate for lower dielectric material can be increased by two times, while excellent planarization effect can be obtained.
Inventors:
CHEN, Jery, Guodong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
WANG, Shumin (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
王淑敏 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
YU, Chris, Chang (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
WANG, Shumin (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
王淑敏 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
YU, Chris, Chang (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
Application Number:
CN2007/001696
Publication Date:
December 06, 2007
Filing Date:
May 24, 2007
Export Citation:
Assignee:
ANJI MICROELECTRONICS (SHANGHAI) CO., LTD (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
安集微电子（上海）有限公司 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
CHEN, Jery, Guodong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
WANG, Shumin (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
王淑敏 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
安集微电子（上海）有限公司 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
CHEN, Jery, Guodong (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
陈国栋 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
WANG, Shumin (Suite 613-618, Building #5No. 3000 Longdong Avenue,Zhangjiang Hi-tech Park,Pudong, Shanghai 3, 201203, CN)
王淑敏 (中国上海市浦东张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 3, 201203, CN)
International Classes:
C09G1/02; C09K3/14; H01L21/304; C09G1/00; C09K3/14; H01L21/02
Attorney, Agent or Firm:
ZHENGHAN LAW FIRM (18th Floor, South Tower of Shanghai Stock Exchange BuildingN?528 Pu Dong Road S, hanghai 0, 200120, CN)
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