POLISHING SLURRY - Vitamin C60 BioResearch Corporation

Title:

POLISHING SLURRY

Document Type and Number:

WIPO Patent Application WO/2007/020939

Kind Code:

A1

Abstract:

A polishing slurry to be used for polishing conductor or metal is characterized in that the polishing slurry contains water, fullerene or fullerene derivative, and the particle diameter of the fullerene or the fullerene devivative is 100nm or smaller. A planarity of 2nm or less in 20μm square is achieved by having the particle diameter of the fullerene or the fullerene derivative 100nm or less.

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Inventors:

MIYOSHI, Takashi (1-1 Yamadaoka, Suita-sh, Osaka 71, 5650871, JP)
三好隆志 (〒71 大阪府吹田市山田丘１番１号国立大学法人大阪大学内 Osaka, 5650871, JP)
TAKAYA, Yasuhiro (1-1 Yamadaoka, Suita-sh, Osaka 71, 5650871, JP)
高谷裕浩 (〒71 大阪府吹田市山田丘１番１号国立大学法人大阪大学内 Osaka, 5650871, JP)
KOKUBO, Ken (1-1 Yamadaoka, Suita-sh, Osaka 71, 5650871, JP)

Application Number:

JP2006/316096

Publication Date:

February 22, 2007

Filing Date:

August 16, 2006

Export Citation:

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Assignee:

Vitamin C60 BioResearch Corporation (3-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 86, 1008086, JP)
ビタミンＣ６０バイオリサーチ株式会社 (〒86 東京都千代田区丸の内二丁目３番１号 Tokyo, 1008086, JP)
MIYOSHI, Takashi (1-1 Yamadaoka, Suita-sh, Osaka 71, 5650871, JP)
三好隆志 (〒71 大阪府吹田市山田丘１番１号国立大学法人大阪大学内 Osaka, 5650871, JP)
TAKAYA, Yasuhiro (1-1 Yamadaoka, Suita-sh, Osaka 71, 5650871, JP)
高谷裕浩 (〒71 大阪府吹田市山田丘１番１号国立大学法人大阪大学内 Osaka, 5650871, JP)

International Classes:

H01L21/304; B24B37/04

Attorney, Agent or Firm:

MORISHITA, Sakaki (2-11-12 Ebisu-Nishi, Shibuya-ku Tokyo, 21, 1500021, JP)

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