Title:
POLISHING SOLUTION FOR COPPER POLISHING, AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/008237
Kind Code:
A1
Abstract:
A polishing solution for copper polishing, which comprises a first organic acid component that is at least one component selected from an organic acid having a hydroxy group, a salt of the organic acid and an acid anhydride of the organic acid, an inorganic acid component that is at least one component selected from an inorganic acid having a valency of 2 or more and a salt of the inorganic acid, an amino acid, a protective film forming agent, abrasive grains, an oxidizing agent and water, wherein the content of the inorganic acid component is 0.15 mass% or more in terms of inorganic acid content, the content of the amino acid is 0.30 mass% or more, and the content of the protective film forming agent is 0.10 mass% or more all relative to the total amount of the polishing solution for copper polishing, and the ratio of the content of the first organic acid component in terms of organic acid content to the content of the protective film forming agent is 1.5 or more.
Inventors:
ONO Hiroshi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
SHINODA Takashi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
SHINODA Takashi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
Application Number:
JP2011/062941
Publication Date:
January 19, 2012
Filing Date:
June 06, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
ONO Hiroshi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
ONO Hiroshi (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
小野 裕 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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