Title:
POLISHING SOLUTION FOR METAL AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/112418
Kind Code:
A1
Abstract:
Provided is a polishing solution for metal intended for polishing at least part of a metal, which includes: (A) an amino acid, (B) a 1-hydroxybenzotriazole, (C) a compound with a benzotriazole skeleton (except 1-hydroxybenzotriazole), (D) a polymer having at least one structural unit of among: structural unit derived from (meta)acrylic acid, structural unit derived from (meta)acrylate, structural unit derived from (meta)acrylamide, and structural unit derived from amino(meta)acrylamide. Weight average molecular mass of compound (D) is 10000 or more, total mass ratio of total content of compound (B) and compound (C) to the total content of (D) is 0.15 to 3.00 and pH is 3.0 to 6.0.
Inventors:
ICHIGE YASUHIRO (JP)
HAGA KOUJI (JP)
KONDO SEIICHI (JP)
HAGA KOUJI (JP)
KONDO SEIICHI (JP)
Application Number:
PCT/JP2014/050153
Publication Date:
July 24, 2014
Filing Date:
January 08, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| WO2006112519A1 | 2006-10-26 |
Foreign References:
| JP2009087981A | 2009-04-23 | |||
| JP2009088080A | 2009-04-23 | |||
| JP2003100677A | 2003-04-04 | |||
| JP2007096253A | 2007-04-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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