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Patent Searching and Data


Title:
POLISHING SYSTEM AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/002568
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a polishing system comprising: a polishing unit comprising a polishing wheel part, and a rotation unit for rotating the polishing wheel part around a rotating shaft; and a driving unit that controls the linear motion of the polishing unit so that the inter-contact force at the surface where a body to be polished and the polishing unit are in contact with each other is uniform in the polishing direction.

Inventors:
LEE, Ki Heon (KR)
PARK, Ji Hun (KR)
HAN, Jung Yul (KR)
YU, Seong Gon (KR)
Application Number:
KR2020/004337
Publication Date:
January 07, 2021
Filing Date:
March 30, 2020
Export Citation:
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Assignee:
MEERE COMPANY INC. (KR)
International Classes:
B24B7/22; B24B49/16; B23Q17/00
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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