Title:
POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/073202
Kind Code:
A1
Abstract:
Provided is a polishing system that contributes to space saving, productivity improvement, and also to equipment cost reduction.
In a polishing system (1), when a workpiece batch transfer apparatus (60) loads workpieces in a batch to a polishing apparatus (10), the workpiece batch transfer apparatus (60) is brought into a state wherein the workpiece batch transfer apparatus can move between a polishing apparatus guide section (20) and a loading guide section (304) by having a workpiece supplying/ejecting apparatus (30) bring up a loading table (305) and have the guide sections adjacent to each other, and the workpiece transfer apparatus (60) holds all of the workpieces on the loading table (305) in a batch, and transfers the workpieces to a workpiece carrier of the polishing apparatus (10), thereby significantly reducing a loading time.
Inventors:
ONOZUKA TAKASHI (JP)
SATO TOMOAKI (JP)
SATO TOMOAKI (JP)
Application Number:
PCT/JP2012/050888
Publication Date:
May 23, 2013
Filing Date:
January 18, 2012
Export Citation:
Assignee:
HAMAI COMPANY LTD (JP)
ONOZUKA TAKASHI (JP)
SATO TOMOAKI (JP)
ONOZUKA TAKASHI (JP)
SATO TOMOAKI (JP)
International Classes:
B24B41/06; B23Q7/14; B24B37/04; H01L21/677
Foreign References:
JP2000190214A | 2000-07-11 | |||
JPS61151858U | 1986-09-19 | |||
JP2004306203A | 2004-11-04 | |||
JP2000079532A | 2000-03-21 | |||
JP2004119462A | 2004-04-15 | |||
JP2001025946A | 2001-01-30 | |||
JPH0413553A | 1992-01-17 | |||
JPH0919862A | 1997-01-21 |
Attorney, Agent or Firm:
MORITA YUICHI (JP)
Morita Yuichi (JP)
Morita Yuichi (JP)
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Claims:
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