Title:
POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/074738
Kind Code:
A1
Abstract:
A polishing system 1 includes a plurality of polishing devices 11 arranged aligned in a y-axis direction, and a holder 13 that holds a rectangular cell 9 so that the cell contacts each polishing surface of a polishing device 11. The polishing surfaces of the polishing device 11 are movable in an x-axis direction by an x-axis direction movement device 12. The holder 13 is movable in a z-axis direction or rotatable in the z-axis direction by a z-axis movement/rotation device 14. The holder 13 and the z-axis movement/rotation device 14 are movable in the y-axis direction by a y-axis direction movement device 15. The holder 13 holds the rectangular cell 9 while housed in a recessed portion of the rectangular cell 9. The polishing surface of the polishing device 11 is pressed against a light measurement region of the rectangular cell 9 set in the holder 13, and polishing is carried out as a result of the polishing device 11 moving in the x-axis direction. The rectangular cell 9 is moved in the y-axis direction and, as a result, is polished by another polishing device 11 using, for example, a finer particle size. Additionally, the rectangular cell 9 is rotated 180 degrees around the z-axis so that each of the two opposing light measurement regions is polished.
Inventors:
YUASA KENJI (JP)
IGARASHI TAKAYUKI (JP)
IGARASHI TAKAYUKI (JP)
Application Number:
PCT/JP2020/037882
Publication Date:
April 14, 2022
Filing Date:
October 06, 2020
Export Citation:
Assignee:
YEP CO LTD (JP)
International Classes:
B24B7/04; B24B7/02; B24B7/17; B24B41/06
Foreign References:
| JP2000308951A | 2000-11-07 | |||
| JP2010115756A | 2010-05-27 | |||
| JP2018099739A | 2018-06-28 | |||
| JP2002292567A | 2002-10-08 | |||
| JP2018196924A | 2018-12-13 | |||
| JP2009119537A | 2009-06-04 | |||
| JP2001025951A | 2001-01-30 |
Attorney, Agent or Firm:
ASAHI PATENT FIRM (JP)
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