Title:
POLISHING TAPE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/054378
Kind Code:
A1
Abstract:
A polishing tape capable of smoothly polishing the edge of work at a high polishing rate without contaminating the work with metals; and a polishing method. While pressing a polishing tape (30) against the edge (21) of the work (20), a contact pad (12) or contact roller (13) is intermittently or continuously reciprocated along the edge of the work to polish the surface portion (22), end surface portion (23), and back surface portion (24) of the edge of the work. The polishing tape (30) has a polishing layer in the form of diamond particles of 0.1μm - 16μm in average particle diameter bound together by a binder. With the polishing tape (30) replaced, a plurality of such polishing operations may be performed. In this case, the polishing tapes (30) used for their respective polishing operations differ from each other in the average particle diameter of diamond particles.
Inventors:
KUMASAKA NORIYUKI (JP)
Application Number:
PCT/JP2005/012926
Publication Date:
May 26, 2006
Filing Date:
July 13, 2005
Export Citation:
Assignee:
NIHON MICROCOATING CO LTD (JP)
KUMASAKA NORIYUKI (JP)
KUMASAKA NORIYUKI (JP)
International Classes:
B24D11/00; B24B9/00; B24B21/00; B24D3/00; H01L21/304
Foreign References:
| JP2001179640A | 2001-07-03 | |||
| JP2001205549A | 2001-07-31 | |||
| JP2002361565A | 2002-12-18 | |||
| JPH0985632A | 1997-03-31 | |||
| JP2003145433A | 2003-05-20 | |||
| JPH1199458A | 1999-04-13 |
Other References:
See also references of EP 1813388A4
Attorney, Agent or Firm:
Takeuchi, Sumio (6-21 Nishishimbashi 1-chom, Minato-ku Tokyo 03, JP)
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