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Patent Searching and Data


Title:
POLISHING TAPE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/054378
Kind Code:
A1
Abstract:
A polishing tape capable of smoothly polishing the edge of work at a high polishing rate without contaminating the work with metals; and a polishing method. While pressing a polishing tape (30) against the edge (21) of the work (20), a contact pad (12) or contact roller (13) is intermittently or continuously reciprocated along the edge of the work to polish the surface portion (22), end surface portion (23), and back surface portion (24) of the edge of the work. The polishing tape (30) has a polishing layer in the form of diamond particles of 0.1μm - 16μm in average particle diameter bound together by a binder. With the polishing tape (30) replaced, a plurality of such polishing operations may be performed. In this case, the polishing tapes (30) used for their respective polishing operations differ from each other in the average particle diameter of diamond particles.

Inventors:
Kumasaka, Noriyuki c/o NIHON MICROCOATING CO. LTD. (4-1, Musashino 3, -chome, Akishima-sh, Tokyo 21, 19600, JP)
Application Number:
PCT/JP2005/012926
Publication Date:
May 26, 2006
Filing Date:
July 13, 2005
Export Citation:
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Assignee:
NIHON MICROCOATING CO., LTD. (4-1 Musashino 3-chome, Akishima-shi Tokyo, 21, 19600, JP)
Kumasaka, Noriyuki c/o NIHON MICROCOATING CO. LTD. (4-1, Musashino 3, -chome, Akishima-sh, Tokyo 21, 19600, JP)
International Classes:
B24D11/00; B24B9/00; B24B21/00; B24D3/00; H01L21/304
Foreign References:
JP2001179640A
JP2001205549A
JP2002361565A
JPH0985632A
JP2003145433A
JPH1199458A
Other References:
See also references of EP 1813388A1
Attorney, Agent or Firm:
Takeuchi, Sumio (NBF Toranomon Building, 6-21 Nishishimbashi 1-chom, Minato-ku Tokyo 03, 10500, JP)
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