Title:
POLISHING TOOL, POLISHING METHOD, AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/068500
Kind Code:
A1
Abstract:
Provided are a polishing tool that is capable of improving the surface accuracy of an object to be polished while using an existing polishing device, a polishing method, and a polishing device. This polishing tool is characterized by being equipped with a polishing surface (3b) that has a predetermined curvature radius and a vacancy (3c) that is formed on the inner side of the polishing surface (3b), said vacancy being concentric with the outer edge of the polishing surface (3b) about the rotation axis of the polishing surface in a projection plane orthogonal to the rotation axis, wherein the polishing surface (3b) has a spherical zone-like shape, and the ratio of the outer diameter (Dg) to the inner diameter (Dn) of the polishing surface (3b) is greater than 1.0 but not exceeding 6.0.
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Inventors:
HAGIWARA GENICHIRO (JP)
Application Number:
PCT/JP2014/076290
Publication Date:
May 14, 2015
Filing Date:
October 01, 2014
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
B24D7/00; B24B13/02
Foreign References:
| JPS5110464Y1 | 1976-03-19 | |||
| US2607174A | 1952-08-19 | |||
| JP2013226620A | 2013-11-07 | |||
| JPS63120071A | 1988-05-24 | |||
| JPH09300191A | 1997-11-25 | |||
| JP2006136959A | 2006-06-01 |
Other References:
See also references of EP 3069822A4
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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