Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING TOOL
Document Type and Number:
WIPO Patent Application WO/2018/025915
Kind Code:
A1
Abstract:
This polishing tool comprises a laminate plate that has a thermosetting resin layer and a thermoplastic resin layer, wherein the thermosetting resin layer includes an organic fiber aggregate, the thermoplastic resin layer does not include an organic fiber aggregate, and the thermosetting resin layer is arranged on both surfaces of the laminate plate. Preferably, the laminate plate has a three-layer structure including the thermosetting resin layer, the thermoplastic resin layer, and the thermosetting resin layer in this order. The polishing tool has a high elastic bending modulus and a high bending strength.

Inventors:
SENOO, Ryuji (6500, Oda, Yakage-cho, Oda-gu, Okayama 98, 〒7141298, JP)
MIZUNO, Hiroyuki (6500, Oda, Yakage-cho, Oda-gu, Okayama 98, 〒7141298, JP)
TSUBOUCHI, Rina (6500, Oda, Yakage-cho, Oda-gu, Okayama 98, 〒7141298, JP)
NISHIYAMA, Eri (6500, Oda, Yakage-cho, Oda-gu, Okayama 98, 〒7141298, JP)
Application Number:
JP2017/028065
Publication Date:
February 08, 2018
Filing Date:
August 02, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI BAKELITE CO., LTD. (6500, Oda Yakage-cho, Oda-gu, Okayama 98, 〒7141298, JP)
International Classes:
B24B37/28; H01L21/304
Domestic Patent References:
2015-11-12
Foreign References:
JPH10329016A1998-12-15
JP2013094884A2013-05-20
JP2016036872A2016-03-22
JPS6265211U1987-04-23
JP2016132059A2016-07-25
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (Growth-2 Building, 4-9-1 Ima, Kita-ku, Okayama-sh, Okayama 75, 〒7000975, JP)
Download PDF: