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Title:
POLY-4-METHYL-1-PENTENE RESIN COMPOSITION, FILM, AND MOLD FOR PRODUCING ELECTRONIC COMPONENT SEALING BODY
Document Type and Number:
WIPO Patent Application WO/2006/013774
Kind Code:
A1
Abstract:
This invention provides a poly-4-methyl-1-pentene resin composition, which has a short semi-crystallization time, can be molded into a film having a high degree of surface crystallization and has a low coefficient of blocking. The resin composition comprises a polymer having a 4-methyl-1-pentene content of not less than 80% by mass and a melting point of 170 to 240°C, and a semi-crystallization time of 70 to 220 sec. A release film formed by molding the resin composition is also provided. This release film is suitable for the production of FPC, and has good releasability. Further, a mold for the production of an electronic component sealing body and an LED mold are provided. The mold for the production of an electronic component sealing body and LED mold have excellent heat resistance and releasability and are less likely to be deformed upon repeated use in the production of electronic component sealing bodies such as LEDs.

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Inventors:
TANAKA TOORU (JP)
HIROSE TOSHIYUKI (JP)
Application Number:
PCT/JP2005/013827
Publication Date:
February 09, 2006
Filing Date:
July 28, 2005
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
TANAKA TOORU (JP)
HIROSE TOSHIYUKI (JP)
International Classes:
C08J5/18; C08L23/20; H01C17/02; H05K3/46; (IPC1-7): C08L23/20; C08J5/18; H01C17/02; H05K3/46
Foreign References:
JP2002137231A2002-05-14
JPS62246950A1987-10-28
JPS62209153A1987-09-14
JPS62214920A1987-09-21
JPH06114846A1994-04-26
JPH06114846A1994-04-26
JPS5770653A1982-05-01
JPS56138981A1981-10-29
EP0336704A21989-10-11
EP0372126A11990-06-13
JP2003105022A2003-04-09
Other References:
See also references of EP 1775320A4
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