Title:
POLY-OLEFIN RESIN COMPOUND, FILM, PACKAGING MATERIAL, MULTI-CHAMBER CONTAINER AND COVER MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/162396
Kind Code:
A1
Abstract:
The disclosed poly-olefin resin compound contains components (A) and (B) as described below. Components (A) and (B) have a total of 100 mass%: component (A) is 20-95 mass% and component (B) is 5-80 mass%. (A): Poly-olefin resin compound that satisfies requirements (a1), (a2) and (a3). (a1): The amount of monomer unit based on ethylene is 95 mol% or more (however, the total of monomer unit that constitutes poly-olefin resin is 100 mol%). (a2): The 5-carbon branching factor (Nc5) measured by 13C-NMR is less than 1000 carbon atoms per 0.1. (a3): Flow activation energy (Ea) is 40 kJ/mol or more. (B): Polypropylene resin.
Inventors:
SUWA, Hiroyuki (516-7-201, Konakadai-cho Inage-ku, Chiba-sh, Chiba 44, 〒2630044, JP)
Application Number:
JP2011/064603
Publication Date:
December 29, 2011
Filing Date:
June 20, 2011
Export Citation:
Assignee:
SUMITOMO CHEMICAL COMPANY, LIMITED (27-1, Shinkawa 2-chome Chuo-k, Tokyo 60, 〒1048260, JP)
住友化学株式会社 (〒60 東京都中央区新川二丁目２７番１号 Tokyo, 〒1048260, JP)
住友化学株式会社 (〒60 東京都中央区新川二丁目２７番１号 Tokyo, 〒1048260, JP)
International Classes:
C08L23/04; B32B27/32; B65D65/40; B65D77/20; C08L23/10
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (Limited,5-33, Kitahama 4-chome, Chuo-ku,,Osaka-sh, Osaka 50, 〒5418550, JP)
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Claims: