Title:
POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2008/066053
Kind Code:
A1
Abstract:
Disclosed is a polyacetal resin composition which has excellent processability and stability and which, when molded into an article, can reduce the amount of formaldehyde generated from the article and can prevent a compounded ingredient from leaching from the article. Specifically, the polyacetal resin composition comprises (A) 100 parts by weight of a polyacetal copolymer having a hemiformal terminal group in an amount of 1.0 mmol/kg or less, a formyl terminal group in an amount of 0.5 mmol/kg or less and an unstable terminal group in an amount of 0.5 wt% or less; (B) 0.01 to 3 parts by weight of a hindered phenol-type antioxidant; (C) 0.05 to 1 part by weight of at least one compound selected from a guanamine compound and a triazine compound; and (D) 0.01 to 1 part by weight of a compound selected from the group consisting of an isocyanate compound, an isothiocyanate compound and a modified form thereof.
Inventors:
HASE HIROYUKI (JP)
Application Number:
PCT/JP2007/072879
Publication Date:
June 05, 2008
Filing Date:
November 20, 2007
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
HASE HIROYUKI (JP)
HASE HIROYUKI (JP)
International Classes:
C08L59/00; C08K3/22; C08K5/09; C08K5/098; C08K5/13; C08K5/20; C08K5/29; C08K5/3477; C08K5/39
Foreign References:
| JP2005112995A | 2005-04-28 | |||
| JPH06274854A | 1994-09-30 | |||
| JPH06248162A | 1994-09-06 | |||
| JP2001011143A | 2001-01-16 |
Other References:
See also references of EP 2098568A4
Attorney, Agent or Firm:
FURUYA, Satoshi et al. (2-17-8 Nihonbashi-Hamacho, Chuo-ku, Tokyo 07, JP)
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