Title:
POLYACETAL RESIN COMPOSITION AND POLYACETAL RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/018210
Kind Code:
A1
Abstract:
Disclosed is a polyacetal resin composition having blended therein, with respect to 100 parts by mass of a polyacetal resin (A): 0.02-5 parts by mass of a dihydrazone compound (B) formed from at least one selected from the group consisting of dihydrazone compounds (B1) represented by general formula (1) and dihydrazone compounds (B2) represented by general formula (2); 0.01-3 parts by mass of a polyamide resin (C); and 0.01-5 parts by mass of a coloring agent (D) formed from at least one selected from the group consisting of inorganic pigments and organic pigments. The polyamide resin (C) has at least one physical property among i) a physical property regarding the melting point or the softening point is not higher than 180°C and ii) a physical property regarding the amine value being not lower than 2 mgKOH/g.
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Inventors:
FUJIMOTO KUNIHIKO (JP)
OSHIMA MAKIKO (JP)
NAWATA HIDETOSHI (JP)
SATO KOKI (JP)
TAMAKI RYUSUKE (JP)
OSHIMA MAKIKO (JP)
NAWATA HIDETOSHI (JP)
SATO KOKI (JP)
TAMAKI RYUSUKE (JP)
Application Number:
PCT/JP2016/070626
Publication Date:
February 02, 2017
Filing Date:
July 13, 2016
Export Citation:
Assignee:
MITSUBISHI ENGINEERING-PLASTICS CORP (JP)
International Classes:
C08L29/14; B29C45/00; C08K5/30; C08L77/00
Domestic Patent References:
| WO2015115386A1 | 2015-08-06 |
Foreign References:
| JP2015167923A | 2015-09-28 | |||
| JP2006181277A | 2006-07-13 | |||
| JP2009084369A | 2009-04-23 | |||
| JPH11293034A | 1999-10-26 | |||
| JPS57115485A | 1982-07-17 |
Other References:
See also references of EP 3330317A4
Attorney, Agent or Firm:
AOKI Hiroaki et al. (JP)
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