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Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/078570
Kind Code:
A1
Abstract:
Disclosed is a polyacetal resin material which can maintain excellent properties inherent in polyacetal resins including mechanical properties, workability and surface properties, which can improve these properties, and which is maximally reduced in the amount of a gas such as aldehyde generated from the material. Specifically disclosed is a polyacetal resin composition comprising 100 parts by weight of a polyacetal resin (A1) having a substantially linear molecular structure, 0.01 to 20.0 parts by weight of a polyacetal resin having a branched or crosslinked structure (A2), 0.01 to 5.0 parts by weight of a hindered phenol-type antioxidant (B) and 0.01 to 5.0 parts by weight of a hydrazide compound (C).

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Inventors:
SHIMODA AKIHIDE (JP)
IKETANI HIRAKU (JP)
Application Number:
PCT/JP2007/074068
Publication Date:
July 03, 2008
Filing Date:
December 07, 2007
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
SHIMODA AKIHIDE (JP)
IKETANI HIRAKU (JP)
International Classes:
C08L59/00; C08G2/10; C08K5/13; C08K5/20; C08K5/24
Foreign References:
JP2003342442A2003-12-03
JP2005112995A2005-04-28
JPH04345648A1992-12-01
JP2001131252A2001-05-15
JP2001011143A2001-01-16
JPH04345648A1992-12-01
JP2001011143A2001-01-16
Other References:
See also references of EP 2123709A4
Attorney, Agent or Firm:
FURUYA, Satoshi et al. (2-17-8 Nihonbashi-Hamacho, Chuo-k, Tokyo 07, JP)
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