Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/073529
Kind Code:
A1
Abstract:
Provided is a polyacetal resin composition having excellent properties such as high rigidity, low warpage, and low deformation, and in which the mechanical strength has been improved and properties such as rupture lifetime (creep properties) under immersion in hot water or constant stress have been greatly improved. More particularly, the polyacetal resin composition comprising (A1) 30 to 95% by weight of a polyacetal resin having a linear molecular structure, (A2) 0.05 to 10% by weight of a polyacetal resin having a branched or cross-linked structure, (B) 5 to 50% by weight of a powder and granular glass inorganic filler, (C) 0.1 to 10% by weight of a trifunctional isocyanate compound, (D) 0.05 to 2% by weight of a compound selected from (D1) an amine compound and (D2) an organic metal compound containing a metal selected from Sn, Zn, and Pb, and (E) 0 to 20% by weight of an arbitrary additive, the total amount being 100% by weight.
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Inventors:
SHIMODA AKIHIDE (JP)
Application Number:
PCT/JP2009/006837
Publication Date:
July 01, 2010
Filing Date:
December 14, 2009
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
SHIMODA AKIHIDE (JP)
SHIMODA AKIHIDE (JP)
International Classes:
C08L59/04; C08K3/40; C08K5/098; C08K5/17; C08K5/29
Foreign References:
| JP2008044995A | 2008-02-28 | |||
| JP2005029714A | 2005-02-03 | |||
| JPH04145153A | 1992-05-19 | |||
| JPH11181231A | 1999-07-06 | |||
| JPH11181232A | 1999-07-06 |
Attorney, Agent or Firm:
FURUYA, Satoshi et al. (JP)
Satoshi Furuya (JP)
Satoshi Furuya (JP)
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