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Patent Searching and Data


Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/054374
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polyacetal resin composition which exhibits improved strength and long term heat resistance without compromising heat resistance quality such as the amount of formaldehyde generated upon thermal decomposition. The present invention achieves the foregoing by means of a polyacetal resin composition obtained by mixing 100 parts by mass of a linear polyacetal resin (A) with 0.1-100 parts by mass of a branched polyacetal copolymer (B) obtained by copolymerizing: trioxane (a); a cyclic acetal compound (b) having an oxyalkylene group having two or more carbon atoms in the ring; and a polyepoxy compound (c) which has two or more epoxy groups per molecule and which comprises a hydrocarbon other than the epoxy groups.

Inventors:
KIRAI NAOHIRO (JP)
MASUDA EIJI (JP)
Application Number:
PCT/JP2019/033278
Publication Date:
March 19, 2020
Filing Date:
August 26, 2019
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L59/00; C08G2/24
Foreign References:
JPH02113010A1990-04-25
JPS4419263B11969-08-21
JP2000319342A2000-11-21
JP2016516123A2016-06-02
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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