Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/129663
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polyacetal resin composition capable of keeping the generation of formaldehyde from a molded article at a very low level and stably keeping mold deposits at a minimum during molding. The purpose of the present invention is achieved by a polyacetal resin composition containing at least (A) 100 parts by mass of a polyacetal polymer, (B) 0.01-0.50 part by mass of an aliphatic carboxylic acid hydrazide, (C) 0.001-0.50 part by mass of a hydantoin compound having two hydrazinocarbonylalkyl groups, and (D) 0.001-0.30 part by mass of an alkaline earth metal salt of an aliphatic carboxylic acid, the polyacetal resin composition being such that the total amount of (B) and (C) is 0.03-0.55 part by mass per 100 parts by mass of the (A) polyacetal polymer.

Inventors:
TAMAOKA AKIHIRO (JP)
HARASHINA HATSUHIKO (JP)
MONMA TOMOHIRO (JP)
Application Number:
PCT/JP2019/047563
Publication Date:
June 25, 2020
Filing Date:
December 05, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L59/00; C08K5/098; C08K5/25; C08K5/3445
Domestic Patent References:
WO2005044917A12005-05-19
Foreign References:
JP2005163019A2005-06-23
JP2008031348A2008-02-14
JP2008156489A2008-07-10
JP2008260874A2008-10-30
JP2015078387A2015-04-23
JP2017082098A2017-05-18
JP2003192812A2003-07-09
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
Download PDF: