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Title:
POLYAMIC ACID COMPOSITION, METHOD FOR PREPARING POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/060616
Kind Code:
A1
Abstract:
The present invention relates to a polyamic acid composition capable of simultaneously implementing a low dielectric dissipation factor, high adhesive strength, and mechanical characteristics at high temperature, a method for preparing the polyamic acid composition, and a polyimide and polyimide film comprising the polyamic acid composition.

Inventors:
HWANG IN HWAN (KR)
LEE IK SANG (KR)
CHOI JEONG YEUL (KR)
Application Number:
PCT/KR2019/015409
Publication Date:
April 01, 2021
Filing Date:
November 13, 2019
Export Citation:
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Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08L79/08; C08G73/10; C08J5/18
Foreign References:
KR20150037574A2015-04-08
KR20180000863A2018-01-04
JP2019059834A2019-04-18
KR20180089860A2018-08-09
JP2018165346A2018-10-25
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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