Title:
POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, LAMINATE, METHOD FOR PRODUCING LAMINATE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/063202
Kind Code:
A1
Abstract:
The polyamic acid has a 3,3',4,4'-biphenyltetracarboxylic dianhydride residue and a 4,4'-(hexafluoroisopropylidene)diphthalic anhydride residue as tetracarboxylic dianhydride residues and a 4-aminophenyl-4-aminobenzoate residue as a diamine residue. The content of 3,3',4,4'-biphenyltetracarboxylic dianhydride residues is 65-97 mol% (inclusive) relative to the total tetracarboxylic dianhydride residues. The content of 4,4'-(hexafluoroisopropylidene)diphthalic anhydride residues is 3-35 mol% (inclusive) relative to the total tetracarboxylic dianhydride residues. The content of 4-aminophenyl-4-aminobenzoate residues is 50 mol% or more relative to the total diamine residues.
Inventors:
NAKAYAMA HIROFUMI (JP)
Application Number:
PCT/JP2022/037393
Publication Date:
April 20, 2023
Filing Date:
October 06, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| WO2022220286A1 | 2022-10-20 | |||
| WO2022211086A1 | 2022-10-06 |
Foreign References:
| JP2021109908A | 2021-08-02 | |||
| JP2021109910A | 2021-08-02 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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