Title:
POLYAMIC ACID COMPOSITION FOR PRODUCING POLYIMIDE RESIN WITH SUPERIOR ADHESION AND POLYIMIDE RESIN PRODUCED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2020/075908
Kind Code:
A1
Abstract:
Provided is a polyamic acid composition comprising: a polyamic acid in which a dianhydride monomer comprising a first dianhydride having one benzene ring and a second dianhydride having a benzophenone structure, and a diamine monomer comprising a compound represented by chemical formula (1) are polymerized; and an organic solvent, wherein the mole ratio of the second dianhydride to the first dianhydride (the mole number of the second dianhydride / the mole number of the first dianhydride) is 0.2:1 to 1.2:1.
Inventors:
KIM JOO YOUNG (KR)
LEE IK SANG (KR)
RO GYEONG HYEON (KR)
LEE IK SANG (KR)
RO GYEONG HYEON (KR)
Application Number:
PCT/KR2018/014288
Publication Date:
April 16, 2020
Filing Date:
November 20, 2018
Export Citation:
Assignee:
SKCKOLONPI INC (KR)
International Classes:
C08L79/08; C08G73/10; C08J5/18; H01L23/29
Foreign References:
| KR20070092778A | 2007-09-14 | |||
| KR20160083203A | 2016-07-12 | |||
| KR20140137160A | 2014-12-02 | |||
| KR20170076096A | 2017-07-04 | |||
| KR20130076155A | 2013-07-08 |
Attorney, Agent or Firm:
LEE & KO IP (KR)
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