POLYAMIC ACID AND POLYIMIDE, PROCESSES FOR THE PRODUCTION OF SAME, COMPOSITIONS CONTAINING SAME, AND USES THEREOF

WIPO Patent Application WO/2010/100874

A1

The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).

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FUKUKAWA KENICHI
OKAZAKI MASAKI
SAKATA YOSHIHIRO
FUJIO ICHIRO
YAMASHITA WATARU

PCT/JP2010/001332

September 10, 2010

February 26, 2010

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MITSUI CHEMICALS INC (JP)
FUKUKAWA KENICHI
OKAZAKI MASAKI
SAKATA YOSHIHIRO
FUJIO ICHIRO
YAMASHITA WATARU

C08G73/10

JP2006152247A	2006-06-15
JPH0344625A	1991-02-26
JP2006003476A	2006-01-05
JPS5817418A	1983-02-01
JP2006321924A	2006-11-30
JPH10306066A	1998-11-17
JP2002161136A	2002-06-04

WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)

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