Title:
POLYAMIC ACID AND POLYIMIDE
Document Type and Number:
WIPO Patent Application WO/2013/133168
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition for display substrates that is capable of forming a useful polyimide film having high heat resistance, a moderate coefficient of linear expansion, and moderate flexibility. [Solution] This resin composition for display substrates comprises a polyamic acid including a structural unit represented by formula (1) and a structural unit represented by formula (3), or a polyimide including a structural unit represented by formula (2) and a structural unit represented by formula (4). (In formulae (1) to (4): X1 represents a tetravalent organic group having an aromatic group and two carbonyl groups; Y1 represents a divalent aromatic group or aliphatic group; Y2 represents a divalent aromatic group having a fluorene skeleton; and n and m each represent a natural number.)
Inventors:
TAMURA TAKAYUKI (JP)
EBARA KAZUYA (JP)
EBARA KAZUYA (JP)
Application Number:
PCT/JP2013/055690
Publication Date:
September 12, 2013
Filing Date:
March 01, 2013
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08G73/10; C08L63/00; C08L79/08; H05K1/03
Domestic Patent References:
| WO2008041510A1 | 2008-04-10 |
Foreign References:
| JP2007106892A | 2007-04-26 | |||
| JP2009155433A | 2009-07-16 | |||
| JP2007099841A | 2007-04-19 | |||
| JP2012097150A | 2012-05-24 | |||
| JP2008297362A | 2008-12-11 | |||
| JP2009062398A | 2009-03-26 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
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Claims: