Title:
POLYAMIDE ACID COMPOSITION AND METHOD FOR PRODUCING SAME, POLYIMIDE FILM, LAMINATE AND METHOD FOR PRODUCING SAME, AND FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131294
Kind Code:
A1
Abstract:
This polyamide acid composition contains a polyamide acid that has a terminal structure represented by general formula (1), a polyamide acid that has a terminal structure represented by general formula (2) and a polyamide acid that has a terminal structure represented by general formula (3). In the formulae, X represents a tetravalent organic group which is a tetracarboxylic acid dianhydride residue; Y represents a divalent organic group which is a diamine residue; and Z represents a divalent organic group which is an acid anhydride residue. According to the present invention, a polyimide film is obtained by applying a solution of a polyamide acid onto a substrate and subsequently causing dehydration and cyclization of the polyamide acid by means of heating.
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Inventors:
TAKI RYUNOSUKE (JP)
HORII ETSUO (JP)
HORII ETSUO (JP)
Application Number:
PCT/JP2018/046433
Publication Date:
July 04, 2019
Filing Date:
December 17, 2018
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L79/08; C08G69/28; C08G73/10
Domestic Patent References:
WO2014123045A1 | 2014-08-14 |
Foreign References:
JP2006307082A | 2006-11-09 | |||
JPH11152331A | 1999-06-08 | |||
JP2017197645A | 2017-11-02 | |||
JP2016536429A | 2016-11-24 | |||
JPH0894823A | 1996-04-12 | |||
JPH04277525A | 1992-10-02 | |||
JPS4716979B1 | 1972-05-18 |
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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