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Title:
POLYAMIDE ACID COMPOSITION AND METHOD FOR PRODUCING SAME, POLYIMIDE FILM, LAMINATE AND METHOD FOR PRODUCING SAME, AND FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131294
Kind Code:
A1
Abstract:
This polyamide acid composition contains a polyamide acid that has a terminal structure represented by general formula (1), a polyamide acid that has a terminal structure represented by general formula (2) and a polyamide acid that has a terminal structure represented by general formula (3). In the formulae, X represents a tetravalent organic group which is a tetracarboxylic acid dianhydride residue; Y represents a divalent organic group which is a diamine residue; and Z represents a divalent organic group which is an acid anhydride residue. According to the present invention, a polyimide film is obtained by applying a solution of a polyamide acid onto a substrate and subsequently causing dehydration and cyclization of the polyamide acid by means of heating.

Inventors:
TAKI RYUNOSUKE (JP)
HORII ETSUO (JP)
Application Number:
PCT/JP2018/046433
Publication Date:
July 04, 2019
Filing Date:
December 17, 2018
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L79/08; C08G69/28; C08G73/10
Domestic Patent References:
WO2014123045A12014-08-14
Foreign References:
JP2006307082A2006-11-09
JPH11152331A1999-06-08
JP2017197645A2017-11-02
JP2016536429A2016-11-24
JPH0894823A1996-04-12
JPH04277525A1992-10-02
JPS4716979B11972-05-18
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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