Title:
POLYAMIDE ACID, POLYIMIDE, POLYAMIDE ACID SOLUTION, POLYIMIDE LAMINATE, FLEXIBLE DEVICE SUBSTRATE, AND PRODUCTION METHODS THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/098936
Kind Code:
A1
Abstract:
Provided are: a nanosilica-containing polyamide acid which contains nanosilica and a polyamide acid that is a polymer of an alicyclic tetracarboxylic acid dianhydride and an aromatic diamine having a carboxyl group, and which has heat resistance, low thermal expansion properties, excellent transparency and low birefringence; and a nanosilica-containing polyimide. Also provided is a product or member which meets the requirements of high heat resistance and high transparency by using the above-described nanosilica-containing polyamide acid and nanosilica-containing polyimide.
Inventors:
UNO MARI (JP)
Application Number:
PCT/JP2016/085012
Publication Date:
June 15, 2017
Filing Date:
November 25, 2016
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L79/08; B32B7/02; B32B27/20; B32B27/34; C08G73/10; C08K3/36
Domestic Patent References:
| WO2015002273A1 | 2015-01-08 | |||
| WO2005022261A1 | 2005-03-10 |
Foreign References:
| JP2005068347A | 2005-03-17 | |||
| JP2013209498A | 2013-10-10 | |||
| JP2005306940A | 2005-11-04 | |||
| JP2014524512A | 2014-09-22 | |||
| JP2016222798A | 2016-12-28 |
Attorney, Agent or Firm:
MURAKAMI, Takashi (JP)
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