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Patent Searching and Data


Title:
POLYAMIDE ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2014/021319
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polyamide acid resin composition which is able to be formed into a varnish that has a low viscosity, and which is capable of providing a coating film that exhibits excellent mechanical properties after being fired. The present invention also addresses the problem of providing a polyamide acid resin composition wherein a terminal acid anhydride group is less reacted with a diamine and less diamine is precipitated in a varnish. The problems can be solved by a polyamide acid resin composition which is characterized by containing (a) a polyamide acid and (b) a compound that is represented by chemical formula (1). (In chemical formula (1), Z represents a divalent or higher-valent organic group having 2 or more carbon atoms; V represents a structure that is represented by chemical formula (2); and k represents an integer of 2 or more.) (In chemical formula (2), δ represents an oxygen atom or a sulfur atom; W represents an electron-withdrawing group; and each of R11 and R12 independently represents a hydrogen atom or a hydrocarbon group having 1-10 carbon atoms.)

Inventors:
MIYAZAKI DAICHI (JP)
TOMIKAWA MASAO (JP)
Application Number:
PCT/JP2013/070610
Publication Date:
February 06, 2014
Filing Date:
July 30, 2013
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10
Foreign References:
JP2001031764A2001-02-06
JP2009109588A2009-05-21
JP2001031764A2001-02-06
JP2009109588A2009-05-21
Other References:
BEOM JIN KIM: "Phosgen-free synthesis of oligoureas having amino end-groups: their application to the synthesis of poly(urea- imide)", FIBERS AND POLYMERS, vol. 3, no. 2, 2002, pages 55 - 59, XP055167614
See also references of EP 2881417A4
T. MUKAIYAMA; M. TOKIZAWA; H. NOHIRA; H. TAKEI, J. ORG. CHEM., vol. 26, 1961, pages 4381
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