POLYAMIDE COMPOSITION AND MOLDED ARTICLE

Title:

POLYAMIDE COMPOSITION AND MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2018/181995

Kind Code:

A1

Abstract:

The present invention provides a polyamide composition containing: 50–99 parts by mass of (1A) an aliphatic polyamide constituted by a diamine and a dicarboxylic acid; and 1–50 parts by mass of (1B) a semi-aromatic polyamide comprising a dicarboxylic acid unit containing at least 75 mol% isophthalic acid, and a diamine unit containing at least 50 mol% of a diamine comprising 4–10 carbon atoms; the polyamide composition having a tanδ peak temperature of at least 90°C, and a weight-average molecular weight Mw of 15,000 ≤ Mw ≤ 35,000. The present invention also provides a molded article or the like using the polyamide composition.

Inventors:

IEDA SHINJI (JP)
NAGASE KOICHI (JP)
YAMADA HISHO (JP)
MIKAMI JUN (JP)
WAKITA TAKAYUKI (JP)
ARAKI YOSHIFUMI (JP)
KAWATANI KIMIAKI (JP)
OKUMURA TOMOYO (JP)
KONDO YOSHIKIMI (JP)
TERADA KAZUNORI (JP)

Application Number:

PCT/JP2018/013907

Publication Date:

October 04, 2018

Filing Date:

March 30, 2018

Export Citation:

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Assignee:

ASAHI CHEMICAL IND (JP)

International Classes:

C08L77/06; C08G69/26; C08K3/013; C08K3/016; C08K3/32; C08K5/00; C08K5/524; C08K7/06; C08L71/12

Domestic Patent References:

WO2005035664A1

2005-04-21

Foreign References:

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Other References: