POLYAMIDE FILM AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2023/171521

A1

The present invention provides a polyamide film which has excellent heat resistance and excellent flexibility, and which is not only capable of being uniformly stretched both before and after a heat treatment, but also capable of maintaining the uniform state after the uniform stretching by means of the heat treatment and restoring the state before the application of a tension by means of release after the application of the tension. The present invention relates to a polyamide film which contains a polyamide (E) that contains a unit derived from an aliphatic dicarboxylic acid (A) having 18 or more carbon atoms, a unit derived from an aliphatic diamine (B) having 18 or more carbon atoms, a unit derived from an aromatic dicarboxylic acid (C) having 12 or less carbon atoms, and a unit derived from an aliphatic diamine (D) having 12 or less carbon atoms, and which has a melting point of 240°C or higher, an elongation recovery ratio of 30% or more in a hysteresis test, a tensile modulus of 1,500 MPa or less, a 10% elongation strength of 70 MPa or less and a crystal melting enthalpy of 15 J/g or more.

TAKAISHI NAOKI (JP)
MARUO TAKESHI (JP)
HATTORI YOSHIO (JP)

PCT/JP2023/007760

September 14, 2023

March 02, 2023

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UNITIKA LTD (JP)

C08J5/18; B32B27/34; C08G69/34; H05K1/03

WO2021106541A1	2021-06-03
WO2020085360A1	2020-04-30
WO2016001949A1	2016-01-07

JP2008274288A	2008-11-13
JPS6274641A	1987-04-06
JPH06511281A	1994-12-15
JPH0253823A	1990-02-22
JP2021154650A	2021-10-07
JP2020131577A	2020-08-31
JPH02265925A	1990-10-30
US20220049054A1	2022-02-17
CN102532530A	2012-07-04

YAMAO, Norihito et al. (JP)

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