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Patent Searching and Data


Title:
POLYAMIDE-IMIDE FILM AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2018/147606
Kind Code:
A1
Abstract:
An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4 ≤ X/Y ≤ 12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film

Inventors:
JEONG DAWOO (KR)
KIM SUNHWAN (KR)
LEE JIN WOO (KR)
OH DAE SEONG (KR)
LIM DONG JIN (KR)
Application Number:
PCT/KR2018/001498
Publication Date:
August 16, 2018
Filing Date:
February 05, 2018
Export Citation:
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Assignee:
SKC CO LTD (KR)
International Classes:
C08G73/14; C08G73/10; C08J5/18
Foreign References:
KR20160094086A2016-08-09
KR20160083738A2016-07-12
KR20170001644A2017-01-04
KR20160081829A2016-07-08
KR20130029129A2013-03-22
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
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