Title:
POLYAMIDE-IMIDE RESIN, COLORLESS TRANSPARENT FLEXIBLE METAL LAMINATE MADE OF THE SAME, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2008/072495
Kind Code:
A1
Abstract:
Disclosed is a flexible metal laminate which is excellent in heat resistance, flexibility and low thermal expansion, while having sufficient colorlessness and transparency. Also disclosed is a flexible printed wiring board using such a flexible metal laminate. Specifically disclosed is a colorless, transparent, flexible metal laminate wherein a metal foil is arranged, directly or through an adhesive layer, on at least one side of a polyamide-imide resin layer mainly composed of a cyclohexane tricarboxylic acid anhydride. This flexible metal laminate is characterized in that the inherent viscosity of the polyamide acid is not less than 0.8 dl/g but not more than 2.5 dl/g.
Inventors:
SHIMENO KATSUYA (JP)
ITO TAKESHI (JP)
AOYAMA TOMOHIRO (JP)
NISHIMOTO AKIRA (JP)
NAGATA SHOKO (JP)
KURITA TOMOHARU (JP)
ITO TAKESHI (JP)
AOYAMA TOMOHIRO (JP)
NISHIMOTO AKIRA (JP)
NAGATA SHOKO (JP)
KURITA TOMOHARU (JP)
Application Number:
PCT/JP2007/073292
Publication Date:
June 19, 2008
Filing Date:
December 03, 2007
Export Citation:
Assignee:
TOYO BOSEKI (JP)
SHIMENO KATSUYA (JP)
ITO TAKESHI (JP)
AOYAMA TOMOHIRO (JP)
NISHIMOTO AKIRA (JP)
NAGATA SHOKO (JP)
KURITA TOMOHARU (JP)
SHIMENO KATSUYA (JP)
ITO TAKESHI (JP)
AOYAMA TOMOHIRO (JP)
NISHIMOTO AKIRA (JP)
NAGATA SHOKO (JP)
KURITA TOMOHARU (JP)
International Classes:
C08G73/14; B32B15/08; B32B15/088; H05K1/03
Domestic Patent References:
| WO2007108472A1 | 2007-09-27 | |||
| WO2006129771A1 | 2006-12-07 |
Foreign References:
| JP2006028073A | 2006-02-02 | |||
| JPH04288344A | 1992-10-13 | |||
| JPH0559174A | 1993-03-09 | |||
| JPS5693731A | 1981-07-29 | |||
| JP2002161136A | 2002-06-04 | |||
| JPH0710993A | 1995-01-13 |
Other References:
See also references of EP 2103641A4
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